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| SMA6J High junction temperature TransilTM Features Peak pulse power: - 600 W (10/1000 s) - 4 kW (8/20 s) Stand off voltage range: from 5 V to 188 V Unidirectional and bidirectional types Low clamping voltage versus standard series Low leakage current: - 0.2 A at 25 C - 1 A at 85 C Operating Tj max: 175 C JEDEC registered package outline A K Unidirectional Bidirectional SMA (JEDEC DO-214AC) Description The SMA6J Transil series has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical over stress such as IEC 61000-4-4 & 5. They are also in accordance with ISO TR 7637-2, SAE J 113 and DIN 40839 for automotive applications and more generally for surges below 600 W 10/1000 s This Planar technology makes it compatible with high-end equipment like automotive, medical equipment or SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provides a better safety margin to protect sensitive circuits with extended life time expectancy. Packaged in SMA, this minimizes PCB consumption (SMA footprint in accordance with IPC 7531 standard). Order code Part number SMA6JxxA-TR SMA6JxxCA-TR Marking See Table 6. See Table 6. Complies with the following standards: IEC 61000-4-2 level 4: 15 kV(air discharge) 8 kV(contact discharge) MIL STD 893G-Method 3015-7: class3B 25 kV HBM (Human Body Model) TM: TRANSIL is a trademark of STMicroelectronics February 2007 Rev 1 1/10 www.st.com 10 Characteristics SMA6J 1 Table 1. Symbol PPP P IFSM Tstg Tj TL Characteristics Absolute ratings (Tamb = 25 C) Parameter Peak pulse power dissipation (1) Power dissipation on infinite heatsink Non repetitive surge peak forward current for unidirectional types Storage temperature range Operating junction temperature range Maximum lead temperature for soldering during 10 s Tj initial = Tamb Tamb = 55 C tp = 10 ms Tj initial = Tamb Value 600 4 60 -65 to +175 -55 to +175 260 Unit W W A C C C 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Symbol Rth (j-l) Rth (j-a) Thermal resistances Parameter Junction to leads Junction to ambient on printed circuit on recommended pad layout Value 30 120 Unit C/W C/W Table 3. Symbol VRM VBR VCL IRM IPP T VF RD Electrical characteristics - definitions (Tamb = 25 C) Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop Dynamic resistance IPP Unidirectional I IF I IPP VCL VBR VRM IRM IR VF V VCLVBR VRM IR IRM IRM IR V VRMVBR VCL IPP Bidirectional 2/10 SMA6J Table 4. Electrical characteristics - values (Tamb = 25 C) IRM max@VRM Type 25 C 85 C A SMA6J5.0A/CA SMA6J6.0A/CA SMA6J6.5A/CA SMA6J8.5A/CA SMA6J10A/CA SMA6J12A/CA SMA6J13A/CA SMA6J15A/CA SMA6J18A/CA SMA6J20A/CA SMA6J24A/CA SMA6J26A/CA SMA6J28A/CA SMA6J33A/CA SMA6J40A/CA SMA6J48A/CA SMA6J58A/CA SMA6J70A/CA SMA6J85A/CA SMA6J100A/CA SMA6J130A/CA SMA6J154A/CA SMA6J170A/CA SMA6J188A/CA 10 10 10 10 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 50 50 50 50 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 V min VBR @IR(1) typ max V mA Characteristics VCL @IPP RD(2) VCL @IPP RD(2) 10/1000 s 10/1000 s 8/20 s 8/20 s max V 9.1 9.5 A 68 61 56 0.029 0.034 0.040 0.070 0.093 0.133 0.154 0.206 0.288 0.354 0.516 0.600 0.697 0.963 1.42 2.04 2.97 4.38 6.45 9.03 14.9 22.1 30.0 48.5 max V A 0.021 0.022 0.024 0.041 0.040 0.056 0.054 0.075 0.108 0.132 0.184 0.213 0.253 0.356 0.511 0.736 0.863 1.27 1.85 2.58 4.24 6.00 7.39 8.97 T(3) max 10-4/C 5.7 5.9 6.1 7.3 7.8 8.3 8.4 8.8 9.2 9.4 9.6 9.7 9.8 10.0 10.1 10.3 10.4 10.5 10.6 10.7 10.8 10.8 10.8 10.8 5.0 6.40 6.74 7.07 10 6.0 6.70 7.05 7.41 10 13.4 298 13.7 290 14.5 276 18.7 205 19.6 184 23.5 157 23.9 147 27.7 123 33.2 102 36.8 93 44.3 80 47.9 75 51.6 68 60.8 57 73.6 48 88.4 40 100 120 33 27 6.5 7.20 7.58 7.96 10 10.2 8.5 9.4 9.9 10.4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 13.3 41.7 15.7 18.8 20.4 37 31 29 10 11.1 11.7 12.3 12 13.3 14.0 14.7 13 14.4 15.2 15.9 15 16.7 17.6 18.5 18 20.0 21.1 22.1 20 22.2 23.4 24.5 24 26.7 28.1 29.5 26 28.9 30.4 31.9 28 31.1 32.7 34.4 33 36.7 38.6 40.6 40 44.4 46.7 49.1 48 53.3 56.1 58.9 58 64.4 67.8 71.2 70 77.8 81.9 86.0 85 94 99 117 152 180 199 220 104 123 159 189 209 231 23.6 25.1 28.3 21.5 31.4 19.4 37.8 16 40.9 14.9 44.0 13.8 51.9 11.8 62.8 75.4 91.1 110 134 157 204 242 275 328 9.7 8.1 6.7 5.5 4.6 3.8 3 2.4 2.2 2 146 22.5 172 223 19 15 100 111 130 144 154 171 170 189 188 209 265 12.6 292 11.3 323 10.3 1. Pulse test: tp <50ms. 2. To calculate maximum clamping voltage at other surge currents, use the following formula VCLmax = RD x IPP + VBRmax 3. To calculate VBR versus junction temperature, use the following formula: VBR @ Tj = VBR @ 25 C x (1 + T x (Tj - 25)) 50 %IPP 100 Repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s) 0 tr tp t 3/10 Characteristics SMA6J Figure 1. Peak power dissipation versus initial junction temperature Figure 2. Peak pulse power versus exponential pulse duration (Tj initial = 25 C) % 110 100 90 80 70 60 1.0 50 40 30 20 10 0 0 25 50 75 100 125 150 175 200 10.0 PPP(kW) Tj initial=25C Tj(C) 0.1 0.01 0.10 tp(ms) 1.00 10.00 Figure 3. Clamping voltage versus peak pulse current (exponential waveform, maximum values) IPP(A) 1.E+03 Tj = 25C SMA6J5.0A/CA SMA6J10A/CA SMA6J15A/CA tp = 20 s SMA6J26A/CA SMA6J48A/CA SMA6J100A/CA SMA6J188A/CA 1.E+02 1.E+01 1.E+00 tp = 1 ms VCL(V) 1.E-01 1 10 100 1000 4/10 SMA6J Characteristics Figure 4. Junction capacitance versus reverse applied voltage (typical values) (SMA6JxxA) F=1MHz VOSC=30mVRMS Tj=25C SMA6J5.0A Figure 5. Junction capacitance versus reverse applied voltage (typical values) (SMA6JxxCA) F=1MHz VOSC=30mVRMS Tj=25C C(pF) 10000 10000 C(pF) 1000 SMA6J5.0CA SMA6J13CA 1000 SMA6J13A 100 SMA6J26A SMA6J26CA 100 SMA6J58A SMA6J58CA 10 SMA6J188CA 10 1 10 VR(V) 100 SMA6J188A 1 1000 1 10 VR(V) 100 1000 Figure 6. Peak forward voltage drop versus peak forward current (typical values) Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board FR4, SCu = 1 cm2) IFM(A) 1.E+01 Zth(j-a)/Rth(j-a) 1.00 Tj=125C 1.E+00 Tj=25C 0.10 1.E-01 VFM(V) 1.E-02 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 tp(S) 0.01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, eCu = 35 m) Figure 9. Leakage current versus junction temperature (typical values) Rth(j-a)(C/W) 130 120 110 100 90 1.E+02 80 70 60 50 40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1.E+01 1.E+03 1.E+04 IR(nA) VR=VRM VBR11.7V VBR>11.7V SCU(cm2) 1.E+00 25 50 75 Tj(C) 100 125 150 175 5/10 Order information scheme SMA6J 2 Order information scheme SM Surface Mount Package A = SMA package Surge rating 6J = 600 W Stand off voltage example - 85 = 85 V Type A = Unidirectional CA = Bidirectional Packaging TR = Tape and reel A 6J xx CA - TR 6/10 SMA6J Package information 3 Package information Case: JEDEC DO-214AC molded plastic over Planar junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: For unidirectional types the band indicates cathode. Flammability: Epoxy is rated UL94V-0 RoHS package SMA Dimensions Dimensions Ref. E1 Table 5. Millimeters Min. Max. 2.03 0.20 1.65 0.40 2.90 5.35 4.60 1.50 Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.08 0.008 0.065 0.016 0.114 0.211 0.181 0.059 D A1 A2 b 1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75 E c A1 D E b C L A2 E1 L Figure 10. SMA footprint dimensions 1.40 (0.055) 2.63 (0.104) 1.40 (0.055) Figure 11. Marking information Cathode bar (unidirectional devices only ) (0.065) 1.64 e3 5.43 (0.214) xxx z y ww e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week milimeters (inches) 7/10 Package information Table 6. Marking Type SMA6J5.0A-TR SMA6J6.0A-TR SMA6J6.5A-TR SMA6J8.5A-TR SMA6J10A-TR SMA6J12A-TR SMA6J13A-TR SMA6J15A-TR SMA6J18A-TR SMA6J20A-TR SMA6J24A-TR SMA6J26A-TR SMA6J28A-TR SMA6J33A-TR SMA6J40A-TR SMA6J48A-TR SMA6J58A-TR SMA6J70A-TR SMA6J85A-TR SMA6J100A-TR SMA6J130A-TR SMA6J154A-TR SMA6J170A-TR SMA6J188A-TR Marking 6UA 6UB 6UC 6UD 6UE 6UF 6UG 6UH 6UJ 6UK 6UM 6UN 6UO 6UQ 6UR 6US 6UT 6UU 6UV 6UW 6UX 6UY 6UZ 6UAA Type SMA6J5.0CA-TR SMA6J6.0CA-TR SMA6J6.5CA-TR SMA6J8.5CA-TR SMA6J10CA-TR SMA6J12CA-TR SMA6J13CA-TR SMA6J15CA-TR SMA6J18CA-TR SMA6J20CA-TR SMA6J24CA-TR SMA6J26CA-TR SMA6J28CA-TR SMA6J33CA-TR SMA6J40CA-TR SMA6J48CA-TR SMA6J58CA-TR SMA6J70CA-TR SMA6J85CA-TR SMA6J100CA-TR SMA6J130CA-TR SMA6J154CA-TR SMA6J170CA-TR SMA6J188CA-TR Marking 6BA 6BB 6BC 6BD 6BE 6BF 6BG 6BH 6BJ 6BK 6BM 6BN 6BO 6BQ 6BR 6BS 6BT 6BU 6BV 6BW 6BX 6BY 6BZ 6BAA SMA6J In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 SMA6J Ordering information 4 Ordering information Delivery mode Tape and reel Tape and reel Part number SMA6JxxA-TR SMA6JxxCA-TR Marking See Table 6. See Table 6. Package SMA SMA Weight 0.068 g 0.068 g Base qty 5000 5000 5 Revision history Date 21-Feb-2007 Revision 1 First issue. Changes 9/10 SMA6J Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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